Mechanical Analysis and Design
individually lead an attempt in temperature analysis for the developer pack computing unit, for which a 1:1 box model of all the components in the computing unit was re-created with its material composition and ran in a simulation. I tested 3 different material combinations and 3 form factors for the casing of the computing unit which was later verified by external heat expert to be fairly accurate with ±5% error (I was the only person who understood heat analysis internally).
Other projects i was involved in are: LED light directing rod in controller; audio placement analysis on the sides of the glasses legs and computing unit redesign for business-use.
The work done as mechanical designer was however highly confidential and i was stripped away with all files related at the end of my placement.
Other Works
Product Design
& UI/UX
Industrial
Design
Mechanical
Analysis / Design
Creative
Marketing
Operations &
Public Relations
Product Strat.
& Management
